Revolutionary Wi-Fi 7 and 5G Solutions Unveiled by MediaTek at Summit 2023 – A Game-Changer for Mainstream Devices!

Mediatek Announces New RedCap Technology and Filogic Solutions

At the ongoing MediaTek 2023 summit, the company revealed its plans to partner with Meta for making chips for AR glasses. Additionally, MediaTek introduced new RedCap technology and Filogic solutions, targeting fast wireless capabilities for the next generation of smart gadgets and industry-specific solutions.

The RedCap technology is designed to facilitate the connection of various devices, including wearables, AR glasses, and IoT modules, to 5G networks. This advancement aims to bring the benefits of 5G, such as faster data speeds and improved connectivity, to a wider range of devices while being energy-efficient. It consists of two components: the M60 modem IP and the MediaTek T300 chipset series. The M60 consumes less power compared to other 5G solutions, making it suitable for devices with smaller batteries.

In addition to RedCap, MediaTek also introduced two new chipsets, Filogic 860 and Filogic 360, to expand its Wi-Fi 7 product lineup. The Filogic 860 chipset is designed for industrial applications, offering reliable connectivity in busy network environments with features such as a Wi-Fi 7 dual-band access point and advanced network processor. On the other hand, the Filogic 360 is a small-scale chip designed for consumer electronics, such as PCs, laptops, set-top boxes, and streaming devices, featuring Wi-Fi 7 and dual Bluetooth 5.4 radio for excellent connectivity.

Both Filogic chips are expected to be available in the market by mid-2024. These advancements from MediaTek signify a significant step forward in the development of wireless technologies and connectivity solutions for various devices, heralding a new era of fast and efficient connectivity for consumers and industries alike.

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