Mediatek Reveals New Dimensity 8300 Chipset
Today, Mediatek announced the release of their latest chipset, the Dimensity 8300. This new chipset promises to provide faster performance and better power efficiency compared to its predecessors, making it an ideal fit for mid-to-premium smartphones.
The Dimensity 8300 features an octa-core CPU with four Cortex-A715 and four Cortex-A510 cores, along with a Mali-G615 MC6 GPU for enhanced graphics handling. What sets this chipset apart is its full generative AI support, offering a 3.3x boost in AI performance. Additionally, it supports 5G connectivity and integrated power-efficient technology for gaming and demanding tasks.
Based on TSMC’s second-generation 4nm node process architecture, the Dimensity 8300 showcases the latest Arm v9 CPU architecture. Additionally, it brings a 20% faster performance and 30% better power efficiency compared to its predecessor, the Dimensity 8200.
Some other notable specifications of the Dimensity 8300 include 5G connectivity with up to 5.17Gbps downlink speeds and Wi-Fi 6E, as well as APU 780 AI processor, uFS4.0 MCQ memory, and LP5x memory with speeds up to 8533Mbps.
One key highlight of the Dimensity 8300 is its full generative AI support, courtesy of the APU 780 AI processor integrated into the chipset. This allows developers to build AI applications that leverage large language models (LLMs) and offers a 3.3x boost in AI performance compared to its predecessor.
The chipset also supports 14-bit HDR-ISP Imagiq 980 for sharper and clearer videos at up to 4K60 HDR. It integrates HyperEngine technology for power efficiency, intelligently adapting to computing demands, and monitoring device temperature during gaming and other resource-intensive tasks.
While the Dimensity 8300 supports sub-6GHz 5G with speeds up to 5.17Gbps, it does not currently support mmWave 5G. However, it does feature Wi-Fi/Bluetooth hybrid coexistence technology, enabling seamless connectivity for earbuds, wireless gamepads, and other peripherals.
The first devices powered by the MediaTek Dimensity 8300 chipset are expected to launch later this year, offering consumers a new level of performance and efficiency in the mid-to-premium smartphone segment.