MediaTek to unveil Dimensity 8300 midrange chipset next week, Redmi K70 expected to be among the first phones with new SoC
Next week, MediaTek is set to announce its new Dimensity 8300 midrange chipset. The Redmi K70, expected to be one of the first phones on the market with the new SoC, has already made waves with its performance on Geekbench. According to the benchmark results, the Redmi K70 scored 1,512 single-core points and 4,886 multi-core points, slightly higher than the outgoing Dimensity 8200 and 8200 Ultra. This new chipset features 1+3+4 architecture with ARMv8-based cores, including a Cortex-A715 performance core clocked at 3.35GHz, 3x Cortex-A715 cores @ 3.32GHz, and 4x Cortex-A510 efficiency units @ 2.2GHz. The Redmi K70 also boasts a Mali-G615 MC6 GPU.
In addition to its powerful chipset, the listing also revealed that the Redmi K70 will be equipped with 16GB of RAM and will run on Android 14, possibly with Xiaomi’s HyperOS out of the box. Although an official launch date has not been confirmed by Xiaomi, the Redmi K70 is expected to hit the market soon. Additionally, there are rumors of a K70 Pro model with the Snapdragon 8 Gen 3 chip in the works.
The Redmi K70’s Geekbench scores have generated excitement among tech enthusiasts, and many are eagerly anticipating the official release of the new smartphone. With the combination of MediaTek’s Dimensity 8300 chipset and Xiaomi’s innovative features, the Redmi K70 is poised to make an impact in the midrange smartphone market. Stay tuned for more updates on the Redmi K70 and other upcoming devices with the Dimensity 8300 chipset.