MediaTek has just released its new Dimensity 8300 chipset. This is MediaTek’s latest 8000-series chipset and is made using TSMC’s second-generation 4nm process. The Dimensity 8300 is also considered the successor to last year’s Dimensity 8200, and it offers better performance in all areas.
The Dimensity 8300 features 4x Arm Cortex-A715 performance cores with clock speeds of up to 3.35GHz, along with 4x Arm Cortex-A510 efficiency units at up to 2.2GHz. MediaTek claims that this new chipset provides up to 20% faster CPU performance and 30% peak gains in power efficiency compared to the Dimensity 8200.
In addition, the Dimensity 8300 also comes with an Arm Mali-G615 MC6 GPU, offering up to 60% performance gains and 55% improved power efficiency. It supports Quad-channel LPDDR5X RAM at speeds of up to 8,533Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support. The APU 780 inside the Dimensity 8300 makes it the first chip in its class to support Generative AI with stable diffusion and support for LLM with up to 10 billion parameters.
The new chipset also features an integrated 5G modem with support for dual-mode 5G and up to 5.17Gbps downlink on sub-6GHz networks. It is also equipped with Wi-Fi 6E and Bluetooth 5.4 connectivity.
Xiaomi has confirmed that its Redmi K70E will debut with the Dimensity 8300 later this month.
Overall, the Dimensity 8300 provides significant performance upgrades and power efficiency compared to its predecessor, and it is expected to bring better performance to upcoming smartphones equipped with this chipset.